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| 1. general description the TFA9895 is a high efficiency class-d aud io amplifier with a s ophisticated speaker boost protection algorithm that features multi-band compression. it can deliver 2.65 w (rms; thd = 1 %) output power into a 4 ? speaker at a battery voltage of 3.6 v. the internal boost converter raises the supply vo ltage to 5.3 v, providing ample headroom for major improvements in sound quality. a safe working environment is provided for the speaker under all operating conditions. the TFA9895 maximizes acoustic output while ensuring diaphragm displacement and voice coil temperature do not exceed their ra ted limits. this function is based on a speaker box model that operates in all loudspeaker environments (e.g. free air, closed box or vented box). furthermore, advanced signal processing ensures that the quality of the audio signal is never degraded by unwanted clipping or distortion in the amplifier or speaker. unlike competing solutions, the adaptive sound maximizer algorithm uses feedback to accurately calculate both the temperature and the excursion, allowing the TFA9895 to adapt to changes in the acoustic environment. internal intelligent dc- to-dc conversion boosts the supp ly rail to provide additional headroom and power output. the supply voltage is only raised when necessary. this precaution maximizes the output power of the class-d audio amplifier while limiting quiescent power consumption. the multi-band processing improves audio quality and apparent volume by allowing the gain to remain stable in most of the signal while the protection reacts to only those portions that would be unsafe. the TFA9895 al so adds a high-frequency noise gate that improves the sound of poor-quality audio sources. the TFA9895 also incorporates advanced battery protection. by limiting the supply current when the battery voltage is low, it prevents the a udio system drawing excessive load currents from the battery, which could cause a system undervoltage. the advanced processor minimizes the impact of a falling battery voltage on th e audio quality by preventing distortion as the battery discharges. the device features low rf susceptibility because it has a digi tal input interface that is insensitive to clock jitter. the second order closed loop architecture used in a class-d audio amplifier provides excellent audio performance and high supply voltage ripple rejection. the audio input interface is i 2 s and the control settings are communicated via an i 2 c-bus interface. the TFA9895 is available in a 29-bump wlcsp (wafer level chip-size package) with a 400 ? m pitch. TFA9895 boosted class-d audio ampl ifier with speaker boost protection and multiband dynamic range compressor rev. 1 ? 23 october 2013 product short data sheet
TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 2 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 2. features and benefits ? sophisticated speaker-boost and protec tion algorithm that maximizes speaker performance while protecting the speaker: ? fully embedded software, no additional license fee or porting required ? total integrated solution that includes ds p, amplifier, dc-to-dc, sensing and more. ? adaptive excursion control guarantees th at the speaker membrane excursion never exceeds its rated limit ? multiband dynamic range compressor (drc) allows independent control of up to three frequency bands ? real-time temperature protection - direct measurement ensures that voice coil temperature never exceeds its rated limit ? environmentally aware - automatically adap ts speaker parameters to acoustic and thermal changes including compensation for speaker-box leakage ? output power: 2.65 w (rms) into 4 : at 3.6 v supply voltage (thd = 1 %) ? clip avoidance - dsp algorithm prevents clip ping even with sagging supply voltage ? bandwidth extension option to increase low frequency response ? intelligent dc-to-dc converter maximizes audio headroom fr om any supply level and limits current consumption at low battery voltages ? compatible with standard ac oustic echo cancellers (aecs) ? high efficiency and low-power dissipation ? wide supply voltage range (fully operational from 2.5 v to 5.5 v) ? two i 2 s inputs to support two audio sources ? i 2 c-bus control interface (400 khz) ? dedicated speech mode with speech activity detector ? speaker current and voltage monitoring (via the i 2 s-bus) for acoustic echo cancellation (aec) at the host ? fully short-circuit proof across the load and to the supply lines ? sample frequencies from 8 khz to 48 khz supported ? three bit-clock/word-select rati os supported (32x, 48x, 64x) ? option to route i 2 s input direct to i 2 s output to allow a second i 2 s output slave device to be used in combi nation with the TFA9895 ? tdm interface supported ? volume control ? low rf susceptibility ? input interface insens itive to clock jitter ? thermally protected ? low ?pop noise' at all mode transitions 3. applications ? mobile phones ? ta b l e ts ? portable gaming devices TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 3 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection ? portable navigation devices (pnd) ? notebooks/netbooks ? mp3 players and portable media players 4. quick reference data 5. ordering information table 1. quick reference data symbol parameter conditions min typ max unit v bat battery supply voltage on pin v bat 2.5 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i bat battery supply current on pin v bat and in dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no input signal) -1.55-ma on pin v bat and in dc-to-dc converter coil; power-down mode --1 p a i ddd digital supply current on pin v ddd ; operating modes; speaker boost protection activated -20-ma on pin v ddd ; operating modes; coolflux dsp bypassed -4.8-ma on pin v ddd ; power-down mode; bck1= ws1=datai1 =bck2= ws2= datai2 = datai3 = 0 v -10- p a p o(rms) rms output power clip = 00 r l =4 : ; f s = 48 khz - 2.55 - w r l =4 : ; f s = 32 khz - 2.65 - w r l =8 : ; f s = 48 khz - 1.5 - w r l =8 : ; f s = 32 khz - 1.65 - w table 2. ordering information type number package name description version TFA9895uk wlcsp29 wafer level chip-size package; 29 bumps; 3.19 u 2.07 u 0.6 mm TFA9895uk TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 4 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 6. block diagram fig 1. block diagram , & , 1 7 ( 5 ) $ & ( ' ( 9 ' ' ' 7 ) $ ( 6 ' $ 6 & / 3 5 2 7 ( & 7 , 2 1 2 7 3 2 9 3 8 9 3 2 & 3 , ' 3 ( $ ' 6 $ d d d $ ' 6 $ 9 % $ 7 ( , 1 % ( 2 8 7 $ 2 8 7 % & / $ 6 6 ' $ 8 ' , 2 $ 0 3 / , ) , ( 5 & $ : 6 3 : 0 6 3 ( $ . ( 5 3 5 2 7 ( & 7 , 2 1 $ / * 2 5 , 7 + 0 $ 1 ' 9 2 / 8 0 ( & 2 1 7 2 / & r r o ) o x [ ' 6 3 ' $ 7 $ , $ % $ ' $ 7 $ , % & . & , 6 , 1 3 8 7 , 1 7 ( 5 ) $ & ( [ 5 $ 0 5 2 0 0 ( 0 2 5 < $ ' $ 3 7 , 9 ( ' & w r ' & & 2 1 9 ( 5 7 ( 5 ( ' * 1 ' % 9 % 6 7 ' $ 7 $ 2 $ , 6 2 8 7 3 8 7 , 1 7 ( 5 ) $ & ( * 1 ' 3 % 7 ( 0 3 6 ( 1 6 ( 9 % $ 7 6 ( 1 6 ( & ' 9 ' ' 3 % 5 ( * , 6 7 ( 5 6 % & * 1 ' ' 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 7 ( 6 7 ' $ ' & & 8 5 5 ( 1 7 6 ( 1 6 , 1 * 3 5 2 & ( 6 6 2 5 f x u u h q w v h q v l q j ' ( q f & / , 3 3 ( 5 5 , v h q v h 0 8 ; : 6 % $ ' $ 7 $ , % & . & 0 8 ; 0 8 ; j d l q / 5 / j d l q , 6 ' 2 & & + 6 z l w k r x w s l o r w w r q h + 3 ) 3 / / , 3 / / 0 8 ; ' 6 3 r x w TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 5 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 7. pinning information 7.1 pinning a. bottom view b. transparent top view fig 2. bump configuration c b a 010aaa734 bump a1 index area 123 e d 4 56 7 a b c 123 bump a1 index area 456 d e 010aaa735 7 transparent top view fig 3. bump mapping datao datai1 datai3 ads1 234 5 ws1 test3 bck1 test4 scl ads2 outb 67 v ddp gndp test1 outa test2 gndb sda gndd v bat v ddd 010aaa736 bst inb test5 datai2 1 a b bck2 c n.c.d n.c.e ws2 TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 6 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection table 3. pinning symbol pin type description datai2 a1 i digital audio data input 2 datao a2 o digital audio data output datai1 a3 i digital audio data input 1 datai3 a4 i digital audio data input 3 ads1 a5 i address select input 1 ads2 a6 i address select input 2 outb a7 o inverting output ws2 b1 i digital audio word select input 2 ws1 b2 i digital audio word select input 1 b3 test3 b4 i test signal input 3; for test purposes only, connect to pcb ground b5 v ddp b6 p power supply voltage gndp b7 p power ground bck2 c1 i digital audio bit clock input 2 bck1 c2 i digital audio bit clock input 1 c3 test4 c4 o test signal input 4; for test purposes only, connect to pcb ground c5 test1 c6 i test signal input 1; for test purposes only, connect to v bst outa c7 o non-inverting output n.c. d1 - not connected; connect to d2 or to pcb ground scl d2 i i 2 c-bus clock input d3 test5 d4 i test signal input 5; for test purposes only, connect to pcb ground d5 test2 d6 i test signal input 2; for test purposes only, connect to v bst gndb d7 p boosted ground n.c. e1 - not connected; connect to e2 or to pcb ground sda e2 i/o i 2 c-bus data input/output v ddd e3 p digital supply voltage gndd e4 p digital ground v bat e5 i battery supply voltage sense input v bst e6 o boosted supply voltage output inb e7 p dc-to-dc boost converter input TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 7 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 8. functional description the TFA9895 is a highly efficient mono bridge tied load (btl) class-d audio amplifier with a sophisticated speaker boost protection algorithm. figure 1 is a block diagram of the TFA9895. the device contains three i 2 s input interfaces and one i 2 s output interface. one of i 2 s inputs datai1 and datai2 can be selected as the audio input stream. the third i 2 s input, datai3, is provided to support stereo applications and the i 2 s pass-through option. the pass-through option is provided to allow an i 2 s output slave device (e.g. a codec), connected in parallel with the TFA9895, to be routed directly to the audio host via the i 2 s output. the i 2 s output signal on datao can be configured to transmit the dsp output signal, amplifier output current information, datai3 left or right signal information or amplifier gain information. the gain information can be used to facilitate communication between two devices in stereo applications. the speaker boost protection algorithm, runn ing on a coolflux digital signal processor (dsp) core, maximizes the acoustical out put of the speaker while limiting membrane excursion and voice coil temperature to a safe level. the mechanical protection implemented guarantees that speaker membrane excursion never exceeds its rated limit, to an accuracy of 10 %. thermal protection guarantees that the voice coil temperature never exceeds its rated lim it, to an accuracy of ? 10 ? c. furthermore, advanced signal processing ensures that the audio quality is always acceptable. the protection algorithm implements an adapt ive loudspeaker model that is used to predict the extent of membrane excursion. the model is continuously updated to ensure that the protection scheme remains effect ive even when speaker parameter values change or the acoustic enclosure is modified. the speaker boost protection algorithm boos ts the output sound pressure level within given mechanical, thermal and quality limits. an optional bandwidth extension mode extends the low frequency response up to a predefined limit before maximizing the output level. this mode is suitable for listening to high-quality music in quiet environments. a multiband dynamic range compressor allows up to three frequency bands to be controlled independently to improve audio performance. the frequency response of the TFA9895 can be modified via ten fully programmable cascaded second-order biquad filters. the fi rst two biquads are processed with 48-bit double precision; biquads 3 to 8 are processed with 24-bit single precision. at low battery voltage levels, the gain is automatically redu ced to limit ba ttery current. the output volume can be controlled by the speaker boost protection algorithm or by the host application (external). in the latter ca se, the boost features of the speaker boost protection algorithm must be disabled to avoid neutralizing external volume control. the speaker boost protection algorithm ou tput is converted into two pulse width modulated (pwm) signals which are then inje cted into the class-d audio amplifier. the 3-level pwm scheme supports filterless speaker drive. TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 8 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection the adaptive dc-to-dc converter boosts the battery supply voltage in line with the output of the speaker boost protection algorithm. it switches to follower mode (v bst = v bat ; no boost) when the audio output voltage is lower than the battery voltage. 8.1 protection mechanisms the following protection circuits are included in the TFA9895: ? overtemperature protection (otp) ? overvoltage protection (ovp) ? undervoltage protection (uvp) ? overcurrent protection (ocp) ? invalid data protection (idp) the reaction of the device to fault conditio ns differs depending on the protection circuit involved. 8.1.1 overtemperature protection (otp) otp prevents heat damage to the TFA9895. it is triggered when the junction temperature exceeds t act(th_prot) . when otp is activated, the output stages are set floating. otp is cleared automatically via an internal timer (a pproximately 200 ms), after which the output stages start to operate normally again. 8.1.2 supply voltage protection (uvp and ovp) if v bat drops below the undervoltage protection threshold, v p(uvp), uvp is activated and the outputs are set floating. when the supply voltage rises above v p(uvp) again, the system will be restarted after approximately 200 ms. if the power supply voltage (v ddp ) rises above the overvolt age protection threshold, v p(ovp) , ovp is activated and the outputs ar e set floating. the power stages are re-enabled as soon as the supply voltage drops below v p(ovp) again. the system will be restarted after approximately 200 ms. 8.1.3 overcurrent protection (ocp) ocp detects a short circuit across the load or between one of the amplifier outputs and one of the supply lines. when the output current exceeds the overcurrent protection threshold (i o(ocp) ), it is limited to i o(ocp) while the amplifier outpu ts are switching (the amplifier is not powered down completely). this feature is called current limiting. the amplifier can distinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit across the load or to one of the supply lines. the impedance threshold depends on which supply voltage is being used. 8.1.4 invalid data protection (idp) idp checks if the word select signal is correctly connected to the TFA9895. if the bit clock/word select (bck-to-ws) ratio is no t stable, the idp alarm is raised and the TFA9895 powers down, deactiva ting the dsp. the TFA9895 starts up again automatically when the bck-to-ws ratio stabilizes. so, in practice, stable word select and bit clock signals are needed for the TFA9895 to exit power-down mode and also when loading dsp settings. TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 9 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 9. limiting values 10. thermal characteristics 11. characteristics 11.1 dc characteristics table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v bat battery supply voltage on pin v bat ? 0.3 +5.5 v v ddp power supply voltage on pin v ddp ? 0.3 +5.5 v v ddd digital supply voltage on pin v ddd ? 0.3 +1.95 v t j junction temperature - +150 ?c t stg storage temperature ? 55 +150 ?c t amb ambient temperature ? 40 +85 ?c v esd electrostatic discharge voltage according to human body model (hbm) ? 2+2 kv according to charge device model (cdm) ? 500 +500 v table 5. thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air; natural convection - 4-layer application board 60 k/w table 6. dc characteristics all parameters are guaranteed for v bat =3.6 v; v ddd = 1.8 v; v ddp = v bst =5.3 v; l bst =1 ? h [1] ; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit v bat battery supply voltage on pin v bat 2.5 - 5.5 v v ddp power supply voltage on pin v ddp 2.5 - 5.5 v v ddd digital supply voltage on pin v ddd 1.65 1.8 1.95 v i bat battery supply current on pin v bat and in the dc-to-dc converter coil; operating modes with load; dc-to-dc converter in adaptive boost mode (no output signal) -1.55- ma on pin v bat and in the dc-to-dc converter coil; power-down mode --1 ? a i ddd digital supply current on pin v ddd ; operating modes; speaker boost protection activated -20- ma on pin v ddd ; operating modes; coolflux dsp bypassed -4.8- ma on pin v ddd ; power-down mode; bck1 = ws1 = datai1 = bck2 = ws2 = datai2 = datai3 = 0 v -10- ? a TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 10 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection [1] l bst = boot converter inductance; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; value is guaranteed by design and che cked during product validation. pins bck1, ws1, data1, bck2, ws2, da tai2, datai3, ads1, ads2, scl, sda v ih high-level input voltage 0.7v ddd -3.6 v v il low-level input voltage - - 0.3v ddd v c in input capacitance [2] --3pf i li input leakage current 1.8 v on input pin - - 0.1 ? a pins datao, push-pull output stages v oh high-level output voltage i oh =4 ma - - v ddd ? 0.4 v v ol low-level output voltage i ol =4 ma - - 400 mv pins sda, open-drain outputs, external 10 k ? resistor to v ddd v oh high-level output voltage i oh =4 ma - - v ddd ? 0.4 v v ol low-level output voltage i ol =4 ma - - 400 mv pins outa, outb r dson drain-source on-state resistance v ddp = 5.3 v - 100 - m ? protection t act(th_prot) thermal protection activation temperature 130 - 150 ?c v p(ovp) overvoltage protection supply voltage protection on v ddp 5.5 - 6.0 v v p(uvp) undervoltage protection supply voltage protection on v bat 2.3 - 2.5 v i o(ocp) overcurrent protection output current 1.45 - - a dc-to-dc converter v o(vbst) output voltage on pin v bst boosted supply voltage when nominal voltage programmed to 5.3 v 5.25 5.3 5.35 v table 6. dc characteristics ?continued all parameters are guaranteed for v bat =3.6 v; v ddd = 1.8 v; v ddp = v bst =5.3 v; l bst =1 ? h [1] ; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 11 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 11.2 ac characteristics table 7. ac characteristics all parameters are guaranteed for v bat =3.6 v; v ddd = 1.8 v; v ddp = v bst =5.3 v; l bst =1 ? h [1] ; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit amplifier output power p o(rms) rms output power thd+n = 1 %; clip = 00 r l =4 ? ; f s = 48 khz - 2.55 - w r l =4 ? ; f s = 32 khz - 2.65 - w r l =8 ? ; f s = 48 khz - 1.5 - w r l =8 ? ; f s = 32 khz - 1.65 - w thd+n = 1 %; clip = 10 r l =4 ? ; f s = 48 khz - 2.35 - w r l =4 ? ; f s = 32 khz - 2.55 - w r l =8 ? ; f s = 48 khz - 1.25 - w r l =8 ? ; f s = 32 khz - 1.4 - w thd+n = 10 %; clip = 00 r l =4 ? ; f s = 48 khz - 3.75 - w r l =4 ? ; f s = 32 khz - 3.75 - w r l =8 ? ; f s = 48 khz - 2 - w r l =8 ? ; f s = 32 khz - 2 - w amplifier output; pins outa and outb ?v o(offset) ? output offset voltage absolute value - - 1 mv amplifier performance ? po output power efficiency includi ng dc-to-dc converter; p o(rms) = 2.65 w; [2] -80-% thd+n total harmonic distortion-plus-noise p o(rms) = 100 mw; r l =8 ? ; l l =44 ? h [2] -0.030.1% v n(o) output noise voltage a-weighted; datai1 = datai2 = 0 v coolflux dsp disabled and bypassed -31- ? v coolflux dsp enabled [2] -45- ? v s/n signal-to-noise ratio v o = 4.5 v (peak); a-weighted coolflux dsp disabled and bypassed -100-db coolflux dsp enabled [2] -97-db psrr power supply rejection ratio v ripple = 200 mv (rms); f ripple = 217 hz - 90 - db amplifier power-up, power-down and propagation delays t d(on) turn-on delay time pll locked on bck (ipll = 0) f s = 8 khz to 48 khz - - 2 ms pll locked on ws (ipll = 1) f s = 8 khz - - 27 ms f s =48 khz - - 6 ms t d(off) turn-off delay time - - 10 ? s TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 12 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection [1] l bst = boost converter inductor; r l = load resistance; l l = load inductance (speaker). [2] this parameter is not tested during production; value is guaranteed by design and che cked during product validation. 12. application information 12.1 application diagrams t d(mute_off) mute off delay time - 1 - ms t d(soft_mute) soft mute delay time - 1 - ms t pd propagation delay coolflux bypassed f s = 8 khz - - 3.2 ms f s = 48 khz - - 600 ? s speaker boost protection mode, t lookahead =2 ms f s = 8 khz - - 14 ms f s =48 khz - - 4 ms table 7. ac characteristics all parameters are guaranteed for v bat =3.6 v; v ddd = 1.8 v; v ddp = v bst =5.3 v; l bst =1 ? h [1] ; r l = 4 ? [1] ; l l = 20 ? h [1] ; f i = 1 khz; f s = 48 khz; t amb = 25 ? c; default settings, unless otherwise specified. symbol parameter conditions min typ max unit fig 4. typical mono application (simplified) 7 ) $ d d d % $ 6 ( % $ 1 ' 3 5 2 & ( 6 6 2 5 2 8 7 $ 2 8 7 % $ & v s h d n h u r u ( 9 ' ' ' 9 * 1 ' ' 7 ( 6 7 7 ( 6 7 $ ' 6 * 1 ' % $ * 1 ' 3 $ ' 6 $ % ' 7 ( 6 7 % ( ' & 7 ( 6 7 ( & 7 ( 6 7 9 ' ' 3 9 % $ 7 e d w w h u \ ' % & 9 ' ' 3 ? ) & 9 ' ' ' q ) ( ( 9 % 6 7 , 1 % & 9 % $ 7 ? ) / % 6 7 ? + 6 ' $ ( q f ( , & % & . ' $ 7 $ 2 & $ ' $ 7 $ , $ , 6 6 & / ' q f ' ' $ 7 $ , $ % & . & ' $ 7 $ , $ : 6 % : 6 % TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 13 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection fig 5. typical stereo application (simplified) 7 ) $ 2 8 7 $ 2 8 7 % $ & ( 9 ' ' ' 9 * 1 ' ' 7 ( 6 7 7 ( 6 7 $ ' 6 * 1 ' % $ * 1 ' 3 $ ' 6 $ % ' 7 ( 6 7 % ( ' & 7 ( 6 7 ( & 7 ( 6 7 9 ' ' 3 9 % $ 7 e d w w h u \ ' % & 9 ' ' 3 & 9 ' ' ' q ) ( ( 9 % 6 7 , 1 % & 9 % $ 7 ? ) / % 6 7 ? + 6 ' $ ( q f ( ' $ 7 $ , $ % $ 6 ( % $ 1 ' 3 5 2 & ( 6 6 2 5 , & , 6 6 & / ' q f ' ' $ 7 $ 2 $ 7 ) $ d d d 2 8 7 $ 2 8 7 % $ & ( 9 ' ' ' 9 * 1 ' ' 7 ( 6 7 7 ( 6 7 $ ' 6 * 1 ' % $ * 1 ' 3 $ ' 6 $ % ' 7 ( 6 7 % ( ' & 7 ( 6 7 ( & 7 ( 6 7 9 ' ' 3 9 % $ 7 e d w w h u \ ' % & 9 ' ' 3 & 9 ' ' ' q ) ( ( 9 % 6 7 , 1 % & 9 % $ 7 ? ) / % 6 7 ? + 6 ' $ ( q f ( : 6 % ' $ 7 $ , $ 6 & / ' q f ' ' $ 7 $ 2 $ : 6 % ' $ 7 $ , $ % & . & % & . & 9 ' $ 7 $ , $ ' $ 7 $ , $ : 6 % % & . & ' $ 7 $ , $ : 6 % % & . & ? ) ? ) v s h d n h u r u v s h d n h u r u TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 14 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection fig 6. typical mono application with two audio sources and a second i 2 s slave device 7 ) $ 2 8 7 $ 2 8 7 % $ & ( 9 ' ' ' 9 * 1 ' ' 7 ( 6 7 7 ( 6 7 $ ' 6 * 1 ' % $ * 1 ' 3 $ ' 6 $ % ' 7 ( 6 7 % ( ' & 7 ( 6 7 ( & 7 ( 6 7 9 ' ' 3 9 % $ 7 e d w w h u \ ' % & 9 ' ' 3 & 9 ' ' ' q ) ( ( 9 % 6 7 , 1 % & 9 % $ 7 ? ) / % 6 7 ? + 6 ' $ ( q f ( ' $ 7 $ , $ $ 8 ' , 2 6 2 8 5 & ( , & , 6 6 & / ' q f ' ' $ 7 $ 2 $ d d d g d w d r x w s x w z r u g v h o h f w g d w d l q s x w : 6 % e l w f o r f n % & . & ' $ 7 $ , $ ' $ 7 $ , $ : 6 % % & . & ? ) g d w d r s z r u g v h o e l w f o n g d w d l s , 6 p d v w h u z r u g v h o h f w g d w d l q s x w e l w f o r f n 6 ( & 2 1 ' , 6 6 / $ 9 ( ' ( 9 , & ( & 2 ' ( & $ 8 ' , 2 6 2 8 5 & ( , 6 g d w d r s z r u g v h o e l w f o n g d w d l s , 6 p d v w h u v s h d n h u r u TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 15 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 13. package outline fig 7. package outline TFA9895 (wlcsp29) e d o o $ l q g h [ d u h d 5 h i h u h q f h v 2 x w o l q h y h u v l r q ( x u r s h d q s u r m h f w l r q , v v x h g d w h , ( & - ( ' ( & - ( , 7 $ 7 ) $ w i d b s r 8 q l w p p p d [ q r p p l q $ ' l p h q v l r q v p p d u h w k h r u l j l q d o g l p h q v l r q v : / & 6 3 z d i h u o h y h o f k l s v l ] h s d f n d j h e x p s v [ p p 7 ) $ $ $ e ' ( h \ h h y z = ' = ' = ( g h w d l o ; e d o o $ l q g h [ d u h d % $ ' ( & \ ; $ $ $ ( ' & % $ $ & % ? y & ? z e = ( h h = ' = ' h h p p v f d o h TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 16 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 14. soldering of wlcsp packages 14.1 introduction to soldering wlcsp packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering wlcsp (wafer level chip-size packages) can be found in application note an10439 ?wafer level chip scale package? and in application note an10365 ?surface mount reflow soldering description? . wave soldering is not su itable for this package. all nxp wlcsp packages are lead-free. 14.2 board mounting board mounting of a wlcsp requires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the reflow soldering itself 14.3 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 8 ) than a snpb process, thus reducing the process window ? solder paste printing issues, such as sm earing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature), and coo ling down. it is imper ative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 8 . moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 8 . table 8. lead-free process (from j-std-020d) package thickness (mm) package reflow temperature ( ?c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 17 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 14.3.1 stand off the stand off between the substrate and the chip is determined by: ? the amount of printed solder on the substrate ? the size of the solder land on the substrate ? the bump height on the chip the higher the stand off, the better the stresses are released due to tec (thermal expansion coefficient) differences between substrate and chip. 14.3.2 quality of solder joint a flip-chip joint is considered to be a good joint when the entire solder land has been wetted by the solder from the bump. the surface of the joint should be smooth and the shape symmetrical. the soldered joints on a chip should be uniform. voids in the bumps after reflow can occur during the reflow process in bumps with high ratio of bump diameter to bump height, i.e. low bumps with large diameter. no failures have been found to be related to these voids. solder joint inspection after reflow can be done with x-ray to monitor defects such as bridging, open circuits and voids. 14.3.3 rework in general, rework is not recommended. by rework we mean the process of removing the chip from the substrate and replacing it with a new chip. if a chip is removed from the substrate, most solder balls of the chip will be damaged. in that case it is recommended not to re-use the chip again. msl: moisture sensitivity level fig 8. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 18 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection device removal can be done when the substrate is heated until it is certain that all solder joints are molten. the chip can then be carefully removed from the substrate without damaging the tracks and solder lands on the substrate. removing the device must be done using plastic tweezers, because me tal tweezers can damage the silicon. the surface of the substrate should be carefully cleaned and all solder and flux residues and/or underfill remove d. when a new chip is placed on the substrate, use the flux process instead of solder on the solder lands. apply flux on the bumps at the chip side as well as on the solder pads on the substrate. place and align the new chip while viewing with a microscope. to reflow the solder, use the solder profile shown in application note an10365 ?surface mount reflow soldering description? . 14.3.4 cleaning cleaning can be done after reflow soldering. 15. revision history table 9. revision history document id release date data sheet status change notice supersedes TFA9895_sds v.1 20131023 product data sheet - - TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 19 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification. TFA9895_sds all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product short data sheet rev. 1 ? 23 october 2013 20 of 21 nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors TFA9895 boosted class-d audio amplifier with speaker boost protection ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 23 october 2013 document identifier: TFA9895_sds please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 3 5 ordering information . . . . . . . . . . . . . . . . . . . . . 3 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 5 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 functional description . . . . . . . . . . . . . . . . . . . 7 8.1 protection mechanisms . . . . . . . . . . . . . . . . . . 8 8.1.1 overtemperature protection (otp) . . . . . . . . . 8 8.1.2 supply voltage protection (uvp and ovp) . . . . 8 8.1.3 overcurrent protection (ocp) . . . . . . . . . . . . . 8 8.1.4 invalid data protection (idp) . . . . . . . . . . . . . . 8 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 thermal characteristics . . . . . . . . . . . . . . . . . . 9 11 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9 11.1 dc characteristics . . . . . . . . . . . . . . . . . . . . . . 9 11.2 ac characteristics. . . . . . . . . . . . . . . . . . . . . . 11 12 application information. . . . . . . . . . . . . . . . . . 12 12.1 application diagrams . . . . . . . . . . . . . . . . . . . 12 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 14 soldering of wlcsp packages. . . . . . . . . . . . 16 14.1 introduction to soldering wlcsp packages . . 16 14.2 board mounting . . . . . . . . . . . . . . . . . . . . . . . 16 14.3 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 14.3.1 stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.3.2 quality of solder joint . . . . . . . . . . . . . . . . . . . 17 14.3.3 rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14.3.4 cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 19 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 17 contact information. . . . . . . . . . . . . . . . . . . . . 20 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 |
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